Ang AI Hardware Processing ay Umakyat sa Bagong Horizons gamit ang 3D Computing
Pananalapi Ang AI Hardware Processing ay Umakyat sa Bagong Horizons gamit ang 3D Computing 9 minuto ang nakalipas Balita ng Ethereum ng Bitcoin In a remarkable leap forward, a consortium of researchers led by the University of Oxford has unveiled a revolutionary development in the realm of AI hardware processing. Published in Nature Photonics, their latest work introduces a cutting-edge integrated photonic-electronic hardware capable of processing three-dimensional (3D) data. This breakthrough not only addresses the escalating demands of modern AI tasks but also propels computing parallelism to unprecedented levels. The pivotal aspect of this innovation lies in the integration of radio frequencies, unlocking a new dimension for superfast parallel processing—a realm previously unexplored. The evolution of Photonic-Electronic hardware In a landmark publication in 2021, the same research team introduced an integrated photonic processing chip that outpaced traditional electronic approaches in matrix vector multiplication—an essential task for AI and machine learning. The success of this venture birthed Salience Labs, a pioneering photonic AI company. Now, the researchers have pushed the boundaries further by incorporating an extra parallel dimension to their photonic matrix-vector multiplier chips. The “higher-dimensional” processing achieved is a result of leveraging multiple radio frequencies to encode data. This approach catapults parallelism to unprecedented heights, offering a







